POTTING AND ENCAPSULATING

potting circuit board encapsulating circuit board

BMB Coating is specialized in coating components via potting and encapsulating.

COATING OR POTTING?

By means of potting, a particular protection of the components and boards can be achieved.

potting components in a form potting in a form

BMB Coating uses one or two-component materials in the box or in reusable models e.g. for potting in a form or potting in a frame.

POTTING MATERIALS AND POTTING METHODS

With different potting materials or potting methods various levels of protection can be achieved.

The principle decision whether to use coating or potting depends on the protective requirements of the board.

The form of the electronic boards is also important, because there are different conditions for potting and coating whether it is feasible or not.

THIN COATS AND THICK-FILM COATS

Conformal coating with thin coats is usually sufficient against dew and humidity. The price is favourable and the coat can be removed from the components and exchanged in case of repair.

So called thick-film coats have a higher protective effect. With a lover content of solvent and tenfold higher coat thickness, those viscous materials offer an excellent protection against extreme environmental circumstances.